Epitaxial Growth of CaMnO_3–<i>y</i> Films on LaAlO₃(112¯0) by Pulsed Direct Current Reactive Magnetron Sputtering

Development of Zirconium Thin Films by Pulsed Direct Current Magnetron Sputtering: Effect of Pulsed Parameters

This paper characterizes phases present in thin Zr films at 773 K of substrate temperature. The effect of pulsed parameters such as pulse frequency, duty cycle and pulse power during the deposition of Zr film on Si(100) at the substrate temperature of 773 K has been studied. Formation of α-phase of zirconium was noticed with (001) preferred orientation at 773 K. Preferred orientation was found ...

Surface Properties of Nanostructured, Porous ZnO Thin Films Prepared by Direct Current Reactive Magnetron Sputtering

In this paper, the results of detailed X-ray photoelectron spectroscopy (XPS) studies combined with atomic force microscopy (AFM) investigation concerning the local surface chemistry and morphology of nanostructured ZnO thin films are presented. They have been deposited by direct current (DC) reactive magnetron sputtering under variable absolute Ar/O₂ flows (in sccm): 3:0.3; 8:0.8; 10:1; 15:1.5...

CrNx Films Prepared by DC Magnetron Sputtering and High-Power Pulsed Magnetron Sputtering: A Comparative Study

CrNx (0 ≤ x ≤ 0.91) films synthesized using highpower pulsed magnetron sputtering, also known as high-power impulse magnetron sputtering (HiPIMS), have been compared with those made by conventional direct-current (dc) magnetron sputtering (DCMS) operated at the same average power. The HiPIMS deposition rate relative to the DCMS rate was found to decrease linearly with increasing emission streng...

Thermoelectric properties of epitaxial ScN films deposited by reactive magnetron sputtering onto MgO(001) substrates

AlNXOY THIN FILMS DEPOSITED BY DC REACTIVE MAGNETRON SPUTTERING

AlNxOy thin films were produced by DC reactive magnetron sputtering, using an atmosphere of argon and a reactive gas mixture of nitrogen and oxygen, for a wide range of partial pressures of reactive gas. During the deposition, the discharge current was kept constant and the discharge parameters were monitored. The deposition rate, chemical composition, morphology, structure and electrical resis...